TY  - BOOK
AU  - Dini,Jack W.
TI  - Electrodeposition: the materials science of coatings and substrates
U1  - 671.732 D615E 
PY  - 1993///
CY  - New York
PB  - Noyes
KW  - Electroplating
KW  - Adhesion
KW  - Diffusion
ER  -